US Patent for Polymer blend and associated methods of preparation and use Patent Patent # 6,794,110 issued September 21, 2004

In some instances, a hard mask may be used below the resist layer to facilitate transfer of the pattern to a further underlying material layer or section. In the manufacture of integrated circuits, circuit patterns can be formed in the developed areas after resist development, by coating the substrate with a conductive material, e.g., a metallic material, using known techniques such as evaporation, sputtering, plating, chemical vapor deposition, or laser-induced deposition. Dielectric materials may also be deposited by similar means during the process of making circuits. Ions of inorganic elements such as boron, phosphorous, or arsenic can be implanted in the substrate to make p-doped or n-doped circuit transistors. Examples of such processes are disclosed in U.S.

In this regard, the individual effects of each variable on tensile strength reveals true behaviour as noted in “main effects plot” . The “main effects plot” shows the increase of tensile strength with increase of printing temperature, i.e., from ≈26 MPa to ≈28 MPa. Similarly, the increase in surface temperature results in increase of tensile strength, i.e., from ≈26 MPa to ≈30 MPa .

The term “substantially homogeneous” is used to describe a mixture of at least two polymers that have been blended so that each polymer exists as a continuous phase with the other as opposed to one of the polymers existing in a dispersed phase. The term “aryl” as used herein, and unless otherwise specified, refers to an aromatic moiety containing 1 to 5 aromatic rings. For aryl groups containing more than one aromatic ring, the rings may be fused or linked.

The “stl” files were sliced into layers using a slicing software . The parameters for slicing are given in Table 3. 3D printing was performed on a custom-made pellet 3D printer as shown in Figure 1. Pellet 3D printer was selected to avoid thermal degradation of raw material in process of filament extrusion . Editor’s Choice articles are based on recommendations by the scientific editors of MDPI journals from around the world. Editors select a small number of articles recently published in the journal that they believe will be particularly interesting to readers, or important in the respective research area.

Hoang, V.T.; Tao, Q.B.; Truong-Le, B.-T.; Tran, M.S.; Luu, D.B. Experimental study on mechanical behaviors of injection molded PC/PMMA blends. Mech. Conceptualization, M.H.; methodology, M.H.; software, M.H. And J.P.; validation, M.H., H.M. And J.P.; formal analysis, M.H.; investigation, M.H.

Moreover, the two polymer additives also report increase for PP based ABS blend (≈28 MPa) as compared to HDPE based ABS blends (≈26.5 MPa). This shows that the impact of PP is more as compared to HDPE on ABS blends. The substantially homogeneous polymer blend of claim 1, wherein at least one carbon atom indicated as unsubstituted is substituted with an inert nonhydrogen substituent. The substantially homogeneous polymer blend of claim 23, wherein the inert nonhydrogen substituent is F. The substantially homogeneous polymer blend of claim 15, wherein R is selected from the group consisting of adamantyl, norbornyl, isobornyl, 2-methyl-2-adamantyl, 2-methyl-2-isobornyl, 2-methyl-2-tetracyclododecenyl, 1-methylcyclopentyl, and 1-methylcyclohexyl. The substantially homogeneous polymer blend of claim 10, wherein R is selected to render R 5 acid-cleavable.

In fact, the ability of the resist polymer to be developed in aqueous base is critically important in generating high-resolution images. Unfortunately, however, resists based on copolymers such as poly(TBTFMA-co-NBHFA) do not develop well in aqueous base due to their low hydrophilicity. Additionally, the binary interactions in “interaction plot” also describe the variations due to the polymer additives ninninja and in-process temperatures . For example, the binary interaction of printing temperature and polymer additives in ABS blends provides visible increase in tensile strength. The Figure 5 shows the binary increase of tensile strength for PP with increase of printing temperature. Similarly, the surface temperature also presents highest tensile strength with increase of bed temperature to 70 °C.

The substantially homogeneous polymer blend of claim 4, wherein R 5 is CN. The substantially homogeneous polymer blend of claim 4, wherein R 5 is COOR. The substantially homogeneous polymer blend of claim 3, wherein R 3 is CF 3. For example, a positive photoresist composition may include a dissolution inhibitor, and a negative photoresist composition will include a crosslinking agent. If dissolution inhibitors and crosslinking agents are present, they will typically represent in the range of about 1 wt. % to 40 wt.